NVIDIA e TSMC: GPU Rubin con chiplet su nodo N3P (Rumors)
#Blackwell #Chiplet #Componenti #GPU #Hardware #Leak #N3P #Notizie #Novità #NVIDIA #Rumors #SchedeGrafiche #SchedeVideo #Semiconduttori #SoICPackaging #TechNews #Tecnologia #TSMC

https://www.ceotech.it/nvidia-e-tsmc-gpu-rubin-con-chiplet-su-nodo-n3p-rumors/

Addio 16 core: AMD Ryzen con Zen 6 punta a 24 core
#AMD #AMDRyzen #Chiplet #Componenti #Core #CPU #Desktop #GPU #Hardware #Indiscrezioni #Laptop #Leak #Notebook #Notizie #Novità #Processori #Rumors #TechNews #Tecnologia #Zen6

https://www.ceotech.it/addio-16-core-amd-ryzen-con-zen-6-punta-a-24-core/

Die #Chiplet-Technologie ist eine der größten Innovationen der Elektronikbranche und ermöglicht modulares, flexibles #Chipdesign. Chiplet-basierte Systeme bieten hohe Leistung und geringen Stromverbrauch. Das Fraunhofer IIS entwickelt wettbewerbsfähige Lösungen auf System-, Komponenten- und Transistorebene, mit Fokus auf neue Architekturen und effiziente Schnittstellen. Besuche uns bis 15. November 2024 auf der #electronica in München, Halle B4, Stand 141. Mehr dazu: https://s.fhg.de/698

Nuovi processori Intel Core Ultra per laptop e mini pc . I nuovi processori Intel Core Ultra promettono una maggior efficienza energetica, Intelligenza artificiale e una GPU integrata almeno 2 volte più veloce, tutto grazie ad una nuova architettura multi sezione.
https://gomoot.com/nuovi-processori-intel-core-ultra-per-laptop-e-mini-pc/

Congratulations Lisa Su and AMD on receiving the 2024 IEEE Corporate Innovation Award for #chiplet designs for #HPC

https://corporate-awards.ieee.org/recipient/advanced-micro-devices/

#Linux 6.6 Looks To Be Very Lucrative For #AMD #Server Performance
#LinuxKernel brings the EEVDF scheduler, workqueue improvements to benefit #chiplet-based #CPU with multiple L3 caches like AMD's wares, and much more. There are many new features with Linux 6.6 and AMD server CPU performance seems to be benefiting nicely.
https://www.phoronix.com/review/linux66-epyc-xeon

#RISCV #Chiplet #CPU With 432 Cores To Handle #AI & #HPC Workloads In #Space
The newly formed project group called the Parallel Ultra Low Power Platform has developed an #opensource RISC-V silicon AI chip with tape-outs called Occamy. Occamy will be capable of performing high-performance calculations, increasing efficiency while lowering the time it would take to make these calculations previously.
https://wccftech.com/risc-v-chiplet-cpu-with-432-cores-to-handle-ai-hpc-workloads-in-space/ #ESA

RT from eeNews Europe (@eeNewsEurope)

RISC’s in Space // https://www.eenewseurope.com/en/riscs-in-space
@risc_v @ETH_en #riscv #chiplet #automotive #space #wireless #embedded #electronics #analog #smart

Original tweet : https://twitter.com/eeNewsEurope/status/1655854385371521024